| 摘要 |
PROBLEM TO BE SOLVED: To prevent heat generated from a power device from conducting from a heat snick to a thick film substrate by a method wherein a metal glove is used as a spacer for between a heat sink mounting part and the heat sink and both are fixed in parallel at a specific interval. SOLUTION: On a heat sink mounting part 2 provided on a surface of a thick film substrate 1, a plurality of metal gloves 10 of which a diameter is 80 to 200μm and a melting point is higher than a glove-like solder material are uniformly distributed, and solder paste 4 formed by mixing with tlux is applied thereto. Successively, a heat sink 5 of a power device 7 which is fixed to the surface is disposed on the solder paste 4. Successively a temperature of the thick film substrate 1 is increased and a solder material in the solder paste 4 is melted, and the heat sink 5 is fixed onto the heat sink mounting part 2 so that the metal gloves 10 are interposed as a spacer between the heat sink mounting part 2 and the heat sink 5. Thereby, thermal conduction from the heat sink 5 to the thick film substrate 1 can be suppressed. |
