MANUFACTURE OF MULTILAYER WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method wherein a large formation area of a conductor circuit can be obtained while ensuring reliability in a manufacturing method wherein an insulation resin layer is formed after a reference hole is stopped up by using an adhesive tape, a reference hole is exposed and then a conductor circuit is formed by using a reference hole as a reference for positioning. SOLUTION: In this method, a projection part 11 enclosing a reference hole 3 is provided to a core board 2 before an insulation resin layer is formed and a reference hole is stopped up by an adhesive tape put within a range which is enclosed with the projection part 11. Or the projection part 11 enclosing the reference hole 3 with an edge of the core board 2 is provided in the core board 2 before an insulation resin layer is formed and a reference hole is stopped up by an adhesive tape put within a range enclosed with an edge of the core board 2 and the projection part 11.