| 摘要 |
PROBLEM TO BE SOLVED: To enable high temperature solder joint and sufficiently reduce generation of a thermal stress due to temperature change at the times of adhering and using by a method wherein both front and back surface of a unidirectional carbon fiber reinforcing composite material are covered with a specific thin- plate-like metal member by diffusion joint. SOLUTION: In a flat plate 1 of a unidirectional carbon fiber reinforcing composite material in which a carbon fiber is arranged in a thickness direction, by using the flat plate 1 in which thermal conductivity in a length direction of the carbon fiber is sufficiently high, the thermal conductivity in a thickness direction of the flat plate 1 can be increased more than metals such as silver, copper, aluminum, etc. In particular, both the front and back surfaces of the flat plate 1 are structured so as to be covered with a thin-plate-like metal member 2 of a thickness about 50μm or less by diffusion joint. Thereby, as thermal conductivity in a thickness direction is high, radiation property is very excellent. Further, as thermal expansively and elasticity coefficient in a width direction are small, thermal stress generation due to temperature change is small, and adverse influences on a semiconductor like separation do not occur.
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