| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a package for a semiconductor circuit device which is small in size and low in weight and has excellent damp-proof property, heat resistance property and electro-magnetic shield property. SOLUTION: A ceramic circuit board 13 is connected with a second aperture of a gold-plated aluminum alloy container 11 having a first aperture and the second aperture, by an Au-Ge solder 15 via a buffer ring 12 of gold-plated copper. A connection part of the ceramic circuit board 13 with the buffer ring 12 is gold-plated, and a wiring pattern is formed on a semiconductor element mounting surface. A ring 14 made of gold-plated stainless steel is connected with the first aperture of the aluminum alloy container 11 by the Au-Ge solder 15. Then, a semiconductor element 16 is fixed to the wiring pattern portion on the circuit board 13 by a junction member 17. A bonding terminal of the semiconductor element 16 and the wiring pattern on the circuit board 13 are connected with each other by a bonding wire 19. Finally, a cover 18 made of gold-plated stainless steel is mounted on the ring 14 so as to cover the aperture, and joined by welding using a seam welding machine.</p> |
