MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To improve reliability of connection of a connection hole constituting a semiconductor integrated circuit device. SOLUTION: In the case where an alignment margin of a contact hole in a wiring wide portion L1b of a wiring pattern L1 is to be set, when the wiring pattern L1 is transferred onto a photoresist film by exposure, a correction amount for compensating for contraction is added to the alignment margin in the longitudinal direction of the wiring wide portion L1b in order to compensate for significant contraction in the longitudinal direction of the wiring pattern L1 from a set value in comparison with the direction of width of the wiring pattern L1 .