| 摘要 |
PROBLEM TO BE SOLVED: To prevent a bonding wire from being broken due to the stresses to a resin sealed semiconductor device when mounted. SOLUTION: A lead frame and resin sealed semiconductor device using the same are provided. Before bonding a bonding wire 8 to one surface of the inner lead 1, a plated layer 2 formed on this surface and an insulation tape 3 for avoiding peal of a resin from the lead 1 is pasted between the top end of the lead 1 and bonding ball to prevent a bonding wire 8 from being broken due to the stresses to the resin sealed semiconductor device when mounted. |
