| 摘要 |
PROBLEM TO BE SOLVED: To provide a high density mounting substrate by reducing a component mounting area greatly. SOLUTION: A multilayer printed board 1 is constituted by laminating at leas two substrates A, B, a recessed part 2 having a bottom and a depth to enable an IC chip 106 to be mounted to be put is formed in one outer surface of the multilayer printed board 1, the other outer surface of the multilayer printed board is made a chip component mounting surface 7 whereon a chip component 104 is mounted and a specified wiring pattern 3 is formed in a bottom surface of the recessed part 2 and a lamination surface of the board 1. The wiring pattern 3 is electrically connected to a chip mounting surface and a wiring pattern of other layers through throughholes 102, 103, 112 provided to through, interlayer and recessed parts, a connection pad 11 of an IC chip and a bum connection pad 12 provide on the wiring pattern 3 of the recessed part 2 are connected by a conductive connection member 4 by containing an IC chip 106 in the recessed part 2 and the conductive connection member 4 ant the IC chip 106 are sealed by synthetic resin 5. |
