| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition superior in sensitivity and photocurability, capable of forming a pattern in high precision by photolithography and superior in folding resistance, solder resistance, flame retardancy, and coating operability on a film, and to provide a photosensitive laminate using this composition. SOLUTION: This photosensitive composition and the photosensitive laminate having a layer of this composition contain (A) an epoxy group-containing polyamide resin obtained by allowing a carboxylic acid-containing polyamide resin (c), obtained by reaction of a polycarboxylic acid component (a) composed essentially of polycarbonatediol-modified dicarboxylic acid and a diisocyanate (b), to react with an epoxy resin (d) in an equivalent ratio (d)/(c) of >=1, and (B) an epoxy resin, and (C) a cationic photopolymerization initiator. |
