发明名称 ELECTROLESS PLATING OF A METAL LAYER ON AN ACTIVATED SUBSTRATE
摘要 <p>A method of electroless plating at least one homogeneous metal coating in a predetermined pattern on a solid substrate surface having pendant hydroxy groups. The method includes the steps of providing a first monatomic metal layer in a predetermined pattern on the solid substrate surface having pendant hydroxy groups and then immersing the solid substrate surface in a bath containing a chemical reducing agent to build up the at least one homogeneous metal coating only on the monatomic metal layer.</p>
申请公布号 WO1997046326(A1) 申请公布日期 1997.12.11
申请号 US1997009247 申请日期 1997.05.30
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