Electronic component, e.g. piezoelectric component

摘要

The component has an insulating substrate (1) with a pattern of electrodes (2,3) formed on it, a circuit element (4) mounted on the substrate and a cover (7) joined to the substrate so as to cover and seal the circuit element. A conducting section on at least the inner surface of the cover is connected to one electrode of the circuit element and to the electrode pattern on the substrate, whereby the electrode on the circuit element is connected to the electrode pattern via the conducting section of the cover.