| 摘要 |
A surface mounting semiconductor package is disclosed. In order to solve the problem which a conventional semiconductor package passes a trimming process and can not be densified highly because the conventional semiconductor package is sectioned in two parts of upper and lower by a leadframe, leads embedded outside of the package are mounted on the bottom of the package. Thus, the size of the surface mounting semiconductor package is reduced and the maximum leads can be formed within the minimum size of the package.
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