| 摘要 |
<p>An electroless copper plating solution comprising copper ions, a complexing agent, a hypophosphorous acid compound as the reducing agent and a reduction-initiating metal catalyst, which further contains lithium ions either alone or with a polyoxyethylene surfactant; a method for electroless copper plating with this solution; and plated products produced by this method. The use of the above solution makes it possible to form a uniform copper deposit having a needle form on a substrate, and therefore the solution is useful for enhancing the bonding between various metals and various resins, particularly that between conductive circuits and resins in multilayer printed wiring boards or that between copper foils and resins in copper-clad laminates.</p> |
