<p>A device for conditioning the surface of a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element carrying cutting means on its bottom surface and which is adapted for vertical movement into and out of engagement with the surface of a polishing pad and which is adapted for oscillating horizontal movement over the surface of the polishing pad. The cutting means are dispersed in a circular or ring configuration.</p>
申请公布号
DE4480510(T1)
申请公布日期
1997.12.11
申请号
DE19944480510T
申请日期
1994.12.20
申请人
SPEEDFAM CORP., DES PLAINES, ILL., US
发明人
CESNA, JOSEPH V., NILES, ILL., US;VAN WOERKOM, ANTONY G., GILBERT, ARIZ., US