An improved semiconductor package is provided wherein the mounting pad for the semiconductor is made from a material selected from the group consisting of aluminum nitride, diamond, alumina, and boron nitride. <IMAGE>
申请公布号
DE69031680(D1)
申请公布日期
1997.12.11
申请号
DE1990631680
申请日期
1990.12.21
申请人
SGS-THOMSON MICROELECTRONICS, INC., CARROLLTON, TEX., US
发明人
BUTERA, GASPER A., BLUE BELL, PENNSYLVANIA 19422, US
