| 摘要 |
In the structure that the heat sink(1) is formed by a mold through a multistage process from an element(5) and a support plate(7) is formed between a center of both sides in a reinforcement flange(2) of the heat sink(1) and the element(5), the structure of the heat sink for use of a semiconductor is characterized by forming a concave flute(3) in an internal side in a finishing process so as to eliminate the support plate(7) formed in the reinforcement flange(2) of the heat sink(1), to thereby heighten a molding adhesive force of a package and prevent a crack in a state of a high temperature.
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