Multichip interconnection for multichip module containing programmable logic component

摘要

The MCM includes a chip fastening surface (102E) contained on a substrate (102) with a structured metallising on the chip fastening surface forming numerous earth and power supply conductors. On the metallising is secured an integrated circuit (101), whose periphery contains a first row of bond coupling faces (203), within which is formed a second row of bond coupling faces. On the chip fastening surface is secured a second integrated circuit, surrounded by a third row of bond coupling faces, within which is formed a fourth row of bond coupling faces. A first set of wire bonding connections (105) links the second and fourth row of bond coupling faces, while a second such set couples selected faces of the first and third row. A third set, not contg. the second one, couples selected faces of the first row to the metallising, while a fourth set, without the second one, links selected faces of the third row to the metallising. The four sets of wire bonding connections provided in a coplanar manner.