AN INTEGRATED CIRCUIT WHICH USES A RECESSED LOCAL CONDUCTOR FOR PRODUCING STAGGERED INTERCONNECT LINES

摘要

An improved multilevel interconnect structure is provided. The interconnect structure includes several levels of conductors, wherein conductors (104) on one level are staggered with respect to conductors (106) on another level. In densely spaced interconnect areas, interposed conductors (104) are burried in intermetallic dielectric layer (103) drawn to dissimilar elevational levels to lessen the capacitive coupling between the interconnects.