On circuit board mounted multichip module

摘要

The ceramic substrate (13) is fastened by means of a flexible adhesive (2) on a first side of a printed circuit board (12), belonging to the module and having circuit structures, and is contacted to the circuit structures by means of bonding connections (11), and the terminal elements are formed by approximately spherical solder balls (10) applied on to the rear side of the printed circuit board (12), which balls are connected via plated-through holes (via holes) to the circuit structures on the first side of the printed circuit board (12).