| 摘要 |
The invention relates to a device for separating at least one gate (36) from at least one encapsulated electronic component (30) such as for instance a lead frame. The device comprises a frame (2) to which a carrier (3) is connected, above which carrier (3) a counter-carrier (4) also connected to the same frame is movable. An assembly (8) of a gate and an encapsulated electronic component is placeable between the carrier (3) and counter-carrier (4). The device also comprises means for causing the gate (36) to move relative to the encapsulated electronic component (30), respectively for causing the encapsulated electronic component (30) to move relative to the gate (36), whereby the connection between gate (36) and encapsulated electronic component (30) can be broken. |
