发明名称 CLAMPING DEVICE FOR INORGANIC PLATE
摘要 PROBLEM TO BE SOLVED: To rationalize a production process of inorganic plates by eliminating coating work of releasant in a clamping device. SOLUTION: At a lower side of an upper mold platen 12 of a clamping device 11 comprising the upper mold platen 12 and a lower mold platen 13, an abutment plate 16 is attached through tilting means 17A and 17B. When the upper mold platen 12 is to be peeled, the abutment plate 16 is tilted so as to smoothly release an inorganic plate material mat M.
申请公布号 JPH09314535(A) 申请公布日期 1997.12.09
申请号 JP19960154983 申请日期 1996.05.24
申请人 NICHIHA CORP 发明人 INO HIROBUMI
分类号 B30B11/00;B28B11/00;B28B11/24;(IPC1-7):B28B11/24 主分类号 B30B11/00
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