PROCESS FOR FLIP CHIP CONNECTING SEMICONDUCTOR CHIP

摘要

A process for a flip chip connection is capable of improving the reliability of connection and the process can be easily practiced. The process comprises the steps of forming a plurality of stud bumps on the semiconductor chip, on which a plurality of solder bumps are formed, in the vicinity of the outer periphery thereof and outer side of the solder bumps, providing a cutting groove between a plurality of the solder bumps and the stud bumps, mating the solder bumps on the semiconductor chip and the corresponding solder bumps on the circuit board and heating for subsequent integration of the mating solder bumps, and breaking way the outer peripheral portion of the semiconductor chip along the cutting groove after a flip chip connection in order to remove the stud bumps.