| 摘要 |
PROBLEM TO BE SOLVED: To certainly and easily release a molded product even if an ejector pin is not used. SOLUTION: In the molded product releasing method of a resin molding apparatus closing a product to be molded by separable upper and lower molds to mold a resin, an air groove 4 guiding air in the direction crossing the frame surface of the lead frame 6 of a package 7 is formed to the parting surface of the mold and high pressure air is sprayed to the air groove 4 after the molding of the resin by using a high pressure nozzle 5 to apply air pressure to the frame surface to release the package 7 from the mold. |
