| 摘要 |
PROBLEM TO BE SOLVED: To provide a photopolymerizable pressure-sensitive adhesive which is excellent in heat resistance and thermal conductivity, does not cause such a trouble as peeling or degradation even when subjected to heat cycle of quick heating and quick cooling, and can simply bond and fix electronic parts and radiation members without requiring long time and much labor. SOLUTION: This adhesive, excellent in heat resistance and thermal conductivity, is based on a photopolymn, product of a compsn. which contains 100 pts.wt. monomer mixture comprising 70-99wt.% alkyl (meth)acrylate having an alkyl group having on average 2-14 carbon atoms and 30-1wt.% monoethylenically unsatd. monomer copolymerizable therewith (or its partially polymerized product), 0.01-5 pts.wt. poly(meth)acrylate as a crosslinker, 10-300 pts.wt. ceramic powder comprising a covalently bonded substance having a wurtzite or sphalerite structure and the number of valence electrons of 8 or a substance having a hexagonal or graphitic crystal structure, and 0.01-5 pts.wt. photopolymn. initiator. |
