发明名称 |
Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers |
摘要 |
The present invention is a method for chemical-mechanical planarization of semiconductor wafers that is highly useful for planarizing stop-on-feature design wafers. Initially, the wafer is positioned against a liquid solution over a planarizing surface of a polishing pad. At least one of the wafer or the pad is moved with respect to the other at a relatively low velocity to maintain a substantially continuous film of liquid solution between the wafer and the pad. The temperature of a pad platen is also controlled to maintain a relatively low temperature of the liquid solution at which the solution is highly selective to a layer of material on the wafer. |
申请公布号 |
AU3211697(A) |
申请公布日期 |
1997.12.09 |
申请号 |
AU19970032116 |
申请日期 |
1997.05.21 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
KARL M. ROBINSON;MICHAEL A. WALKER |
分类号 |
B24B37/015;B24B49/14;H01L21/304;H01L21/3105 |
主分类号 |
B24B37/015 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|