| 摘要 |
PROBLEM TO BE SOLVED: To bond a metallic film to an org. substrate with a high adhesive strength by activating the surface of a smooth org. substrate by photoirradiation or plasma treatment, further applying an isocyanate soln. and then forming the metallic film by a vapor growth method. SOLUTION: The surface of an org. substrate consisting of a synthetic resin such as epoxy resin is irradiated with a light such as a laser beam or treated with plasma using an inert gas such as Ar and activated. Subsequently, an isocyanate such as hexamethylene diisocyanate is applied by spraying, etc., heat-treated, as required, at 50-100 deg.C for 0.5-2hr and then again treated with plasma to form the thin film of a metal such as Cu in 0.01 to several tenμm thickness by vapor growth of sputtering. A highly adhesive metallic film of Cu, etc., is formed on the org. substrate surface.
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