| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition for sealing a semiconductor, comprising a thermosetting resin, an inorganic filler and a specific mold release agent, excellent in fluidity, filling properties, moldability in a short time, mold releasability from a metallic mold, adhesion to a lead frame or a chip, solder heat resistance and reliability of moisture resistance and useful for a diode, etc. SOLUTION: This resin composition for a sealing semiconductor comprises (A) a thermosetting resin such as an epoxy resin, (B) an inorganic filler, e.g. a fused silica having 10-20μm average particle diameter and (C) a mold release agent, comprising aluminum element and a higher fatty acid such as stearic acid and having 90-150 deg.C transparent melting point, e.g. a metallic soap in an amount of 0.02-1.00wt.% (in the total resin composition).
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