发明名称 MULTILAYER WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To propagate electric signals also forming wiring in high density by forming an insulating board of glass fiber reinforced polyphenylene ether resin board. SOLUTION: An insulating board 1 is made of a glass fiber reinforced polyphenylene ether resin board. That is, the board 1 is formed by impregnating cloth interwoven with a glass fiber with the pecursor of polyphenylene to be thermoset at the temperature of 150 deg.C-200 deg.C. This insulating board 1 is reinforced with the glass fiber. Accordingly, the board 1 gaining excellent mechanical strength can satisfactorily endure any external force or when a multilayer wiring 4 made of an organic resin insulating layer 2 and a thin film wiring conductor 3 is coat.formed on the surface of the board 1.
申请公布号 JPH09312480(A) 申请公布日期 1997.12.02
申请号 JP19960128202 申请日期 1996.05.23
申请人 KYOCERA CORP 发明人 YONEDA CHIKAFUMI
分类号 H05K1/03;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/03
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