| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multichip module inspecting method by which the inspection time can be shortened, the inspection cost can be lowered, and productivity can be improved. SOLUTION: At the time when a multichip module is inspected after semiconductor chips 6a-6d are mounted on a circuit substrate 1 and electrically connected with the circuit substrate 1 as to form vertical connections by connecting output terminals and the input terminals of respective semiconductor chips 6a-6d, the output terminals of the semiconductor chips 6a-6d are set in low impedance state and the outputs are inspected and at the time when respective semiconductor chips 6a-6d are inspected, the output terminals are switched to be in high impedance state and logic signals are sent to the input terminals of the respective semiconductor chips 6a-6d and the outputs of respective semiconductor chips are inspected.</p> |
