| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC package where the heat sink of an IC package can be soldered on a mounting substrate with high reliability. SOLUTION: Grooves 44 are formed at the back of the heat sink 42 of the IC package 40 on the center line in a vertical direction and that on a lateral direction, namely, in the shape of a cross. When solder is applied to a prescribed position on the metallic pattern of the mounting substrate and the heat sink 42 and a metallic pattern are soldered, excess solder is stored in the grooves 44 in the shape of the cross. Thus, the projection of solder from the periphery of the heat radiation plate can be prevented. A solder junction face is controlled and formed and heat is uniformly radiated from the respective IC packages. Thus, the temperatures of the respective IC packages become uniform and the output power and the gains of the respective IC packages become uniform. Thus, the IC package where the heat sink can be soldered on the mounting substrate with high reliability can be realized. |
