发明名称 COOLING DEVICE AND COOLING METHOD
摘要 PROBLEM TO BE SOLVED: To contrive the enhancement of the freedom of installation of a cooling device, the freedom of use of the device, the stability of the device and the reliability of the device by a method wherein when a material to be cooled is cooled by a cooling source, the cooling source and the material to be cooled are thermally connected to each other and when the material to be cooled is heat-insulated, the cooling source and the material to be cooled are thermally separated from each other. SOLUTION: A coil part 41 is provided with a vacuum container 43, a superconducting coil 44 housed in this container 43 and a thermal shield 45 arranged between the coil 44 and the container 43 in such a way as to surround the coil 44, while a refrigeration part 42 is constituted of a vacuum container 60 and an air cooling refrigerator 61 arranged in this container 60. Both of the coil part 41 and the part 42 are made to couple each other (are made to connect thermally each other) without breaking a vacuum only at the time when the coil 44 is cooled. When the coil 44 is heat-insulated, the coil part 41 and the part 42 are made to separate each other (are made to separate thermally each other).
申请公布号 JPH09312210(A) 申请公布日期 1997.12.02
申请号 JP19970064146 申请日期 1997.03.18
申请人 TOSHIBA CORP 发明人 TAKAHASHI MASAHIKO;OTANI YASUMI;KURIYAMA TORU;NAKAGOME HIDEKI;ROOHANA CHIYANDORA TEIRAKA;HATAKEYAMA HIDEO
分类号 F25B9/00;H01F6/04;(IPC1-7):H01F6/04 主分类号 F25B9/00
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