| 摘要 |
PROBLEM TO BE SOLVED: To make thinning and light weighting by specifying the thickness of inner layer copper foil not to exceed a specific value while the thickness of an adhesive sheet to exceed the double thickness of a copper foil but not to exceed the thickness of a base material thin sheet besides, the whole thickness of a multilayer printed-wiring board to be within a specific value. SOLUTION: Within a mulyilayer printed wiring board having three layer wiring circuit made of outer layer copper foil lamination set holding an adhesive sheet on one side of copper plated laminated sheets 6 respectively stacked on both sides of a base material thin sheet, the thickness of the inner layer copper foil of the copper plated laminated sheets 6 is specified not to exceed 0.04mm. Furthermore, the thickness of the adhesive sheet is specified to exceed at least two times of the copper foil also not to exceed the thickness of the base material thin sheet while the whole thickness of the multi-layer printed- wiring board is specified to exceed 0.3mm but not to exceed 0.6mm. |
