| 摘要 |
PROBLEM TO BE SOLVED: To apply a coating at a constant rate without changing delivering conditions in a coating process by a dispense method by specifying the ratio of the volume from an ejection pressure control part to a syringe to the volume of the syringe in use. SOLUTION: The ejection device for liquid resin composition comprises an ejection pressure control part (a) of a dispenser having a pressure gage with a pressure control valve, a syringe (b) into which liquid resin composition is injected, a buffer (c) for changing volume, a plastic tube (d) interconnecting the pressure control part and a buffer, and a plastic tube (e) interconnecting the buffer and the syringe. When a predetermined amount of liquid resin composition is ejected from the syringe to fix a semiconductor element to a predetermined position of a substrate, pressure is made constant by means of the pressure control part and the volume from the pressure control part to the syringe is maintained at a desirable value by adjusting the volume by means of the buffer (c) to control the ratio of the volume from the ejection pressure control part to the syringe to the volume of the syringe in use to 5 or more.
|
