发明名称 Semiconductor manufacturing method and semiconductor device manufacturing apparatus
摘要 To provide a semiconductor device manufacturing method and a semiconductor device manufacturing apparatus in which both a dependency on base material and a film characteristic are satisfied in film forming steps of the semiconductor manufacturing. There are provided a first film forming part 4 and a second film forming part 5 along a transporting direction A in the transporting system 1 for the semiconductor substrate 2, the first film forming part 4 is provided with a post-mixed type gas supplying means 7 for supplying a plurality of kinds of reaction gases onto a semiconductor substrate while the gases are being separated from each other through an inert gas, and the second film forming part 5 is provided with a premixed type gas supplying means 8 for supplying the mixture gas onto the semiconductor substrate while a plurality of kinds of reaction gases are mixed in advance.
申请公布号 US5693579(A) 申请公布日期 1997.12.02
申请号 US19960615778 申请日期 1996.03.14
申请人 SONY CORPORATION 发明人 ISHIKAWA, YOSHIMITSU
分类号 C23C16/44;C23C16/40;C23C16/455;C23C16/54;C23C16/56;H01L21/205;H01L21/31;H01L21/316;(IPC1-7):H01L21/02 主分类号 C23C16/44
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