发明名称 MEASURING METHOD FOR ELECTRONIC COMPONENT TO BE MOUNTED ONTO PRINTED-CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a measuring method in which the measuring time of an electronic component is shortened before the electronic component is mounted onto a printed-circuit board. SOLUTION: An optical sensor 1 which comprises a second optical sensor system 7 for detection of a part o be measured is used. Before an electronic component 14 which is picked up from a component mounting base by a transfer head 12 at a mounting machine is mounted onto a printed-circuit board, it is brought to a position faced with the optical sensor 1. The part, to be measured, at the electronic component 14 is detected by the second optical sensor system 7 at the optical sensor 1. An operation in which a spot beam, for measurement, by the optical sensor 1 is directed to the part, to be measured, so as to be measured on the basis of a detection signal obtained as a result is performed sequentially to all parts, to be measured, in the relative movement of the optical sensor 1 to the electronic component 14.
申请公布号 JPH09311022(A) 申请公布日期 1997.12.02
申请号 JP19960130228 申请日期 1996.05.24
申请人 YASUNAGA:KK 发明人 NISHIMURA SHIGEO
分类号 G01B11/02;G01B11/24;H01L21/66;H05K13/08 主分类号 G01B11/02
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