发明名称 OPTICAL PICKUP, SOLDER PATTERNING METHOD THEREFOR AND POSITIONING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To take a countermeasure for heat generation and to electrically connect substrates to each other by performing metalizing, then using solder as a brazing material and simultaneous or when necessary joining and assembling in a structure composed of a plurality of supports including silicon plates. SOLUTION: A prism 2 is provided on a PD substrate 4 and a polarizing film 10 having a reflectance of 50% or higher for S polarizing components and a transmission factor of >=80% for P polarizing components is provided in a first slope 2a. Thus, a light emitted from a LD1 is reflected tin the normal direction of the PD substrate 4 and made incident on a hologram 5 positioned in an upper side. The hologram 5 forms a hologram pattern 5a having a small curvature, converges light fluxes passing the hologram pattern 5a by an objective lens 6 and irradiates an optical magnetic recording medium 11 with these in spot shapes. A return light reflected by the optical magnetic recording medium 11 is passed through the objective lens 6 and made incident on the hologram 5. A photodetector 3c receives a diffracted light diffracted by the pattern 5a and detects a servo signal.
申请公布号 JPH09312034(A) 申请公布日期 1997.12.02
申请号 JP19960128158 申请日期 1996.05.23
申请人 OLYMPUS OPTICAL CO LTD 发明人 NITTA YOSHIKI
分类号 G11B7/125;G11B7/135;H01S5/00;H05K3/34 主分类号 G11B7/125
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