| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the handling of a large diameter water on a wafer stage. SOLUTION: For this wafer stage, a required number of small holes 2 are bored in a receiving plate 7 whereon a wafer is to be placed, and an air sending line 3 and an intake line 4 are led to the small holes 2, thus intake and suction of air are made possible for the area between the wafer and the receiving plate 7 when the wafer is placed. In this case, the friction between the wafer and the receiving plate 7 decreases by supplying air between the wafer and the receiving plate 7, and the shifting of the wafer to the receiving plate becomes easy, and also the fixation to the receiving plate 7 becomes sure by sucking it.</p> |
