| 摘要 |
PROBLEM TO BE SOLVED: To secure high heat conductivity in a stacking direction and to provide low thermal expansibility. SOLUTION: The high heat conductive layers 3 of copper or copper alloy and the low thermal expansion layers 1 of Fe-Ni system alloy are alternately stacked and they form the multilayered structure of more than 10 layers, desirably more than 50 layers. The high heat conductive layers 3 sandwiching the low thermal expansion layers 1 are made into a composite material for electronic component, which is used for a heat sink or a heat spreader that continues through a plurality of through holes 2 formed on the low thermal expansion layers 1. In the composite material for electronic parts, the thin sheets of copper or copper alloy and the thin sheets of Fe-Ni system alloy, where the plurality of through holes 2 are formed, are alternately stacked, pressure is reduced lower than 10<-3> Torr, pressurization is executed not less than 50MPa in the temperature range of 700-1050 deg.C, and a junction processing is executed. Then, it is made a prescribed board thickness by rolling. |
