| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition having low air permeability, flexibility and heat resistance by using a compound (a) having a polysulfide bond and an epoxy in the molecule and an epoxy resin curing agent (b) having a sulfur atom in the molecule. SOLUTION: Component (a) is typified by a known epoxy-terminated polysulfide compound and is represented by formula I [wherein R1 and R3 are each a 1 C or higher organic group, desirably one having a molecular structure similar to that in a bisphenol A epoxy resin, a phenol novolac epoxy resin or the like; -CH2 -, -CH2 -S- or the like; and R2 is (-C2 H4 OC2 H4 OC2 H4 -SS)- or the like]. Component (b) is exemplified a sulfur-containing amine. This composition is prepared by dissolving component (b) in a solvent (e.g. acetone), mixing the obtained solution with component (a), removing the solvent from the combined solution, applying the residue to form a coating film of a thickness of 20-500μm and curing the film by heating. The obtained film has a softening point of 80 deg.C or above, an air permeability of 25×10ml.cm/cm<2>×sec×cmHg or below and a Young's modulus of elasticity in the range of 1-500MPa.
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