| 摘要 |
PROBLEM TO BE SOLVED: To improve precision of a film punching and bonding device (metal mold) for manufacturing a film to be bonded to a lead frame, and significantly reduce generation of burrs. SOLUTION: The perpendicularity of a guide post 24 with respect to a die plate 26 is precisely adjusted, and the guide post is adhered and fixed at an optimum position (28). Then, a high precision die insertion hole 31 is provided at the center position of the die plate 26, and a dummy punch 30 is provided and inserted into the die insertion hole 31. With reference to this dummy punch 30, a punch section (punch plates 23a, 23b, a bush 27b and the like) is precisely constituted. Then, the dummy punch 30 is removed and a punch 1 is mounted at that position. Also, a die and a strip 34 are mounted in the die insertion hole 31. In this metal mold, the precision is significantly improved in comparison with a conventional metal mold, and the generation of burrs are reduced to approximately a quarter in amount. |
