| 摘要 |
An apparatus for transferring in a lump a plurality of semiconductor silicon wafers (3) from a first cassette (4), which contains the wafers inserted therein, to a second cassette (5), which comprises: a push-rod (10), a wafer loading device (11 or 19), a holding mechanism (12) and a cassette replacing mechanism (14). The push-rod (10) pushes out in a lump the wafers (3) upward from the first cassette (4), and inserts in a lump the wafers (3) thus pushed out upward into the second cassette (5). The wafer loading device (11 or 19) is releasably fitted to the uppermost end (10a) of the push-rod (10), and has a plurality of parallel grooves (11a or 20c) for receiving the wafers (3). The holding mechanism (12) grips the wafer loading device (11 or 19) without coming into contact with the wafers (3) so as to hold the wafers (3) at a prescribed position through the wafer loading device (11 or 19). The cassette replacing mechanism (14) replaces the first cassette (4) with the second cassette (5) while the wafers (3) are held at the prescribed position.
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