发明名称 HOT PRESS FOR MULTI-LAYER WIRING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To surely optimize a heat plate shape of a press forming machine for multi-layer wiring circuit board. SOLUTION: The press machine is provided with plural rams 16, which press each heat plate 10a, 10b with arbitrary pressing force and is arranged in grid shape and an information processing unit to control a whole hot plate for multi- layer wiring circuit board. The information processing unit estimates a shape of the hot plates 10a, 10b in heating/compressing based on the output of each displacement sensor mounted to a jig plate 11b for testing (a relative displacement of the other jig plate 11b for testing against one jig plate 11a for testing). Further, a hydraulic pressure of hydraulic circuit to drive each ram 16 is decided so that each hot plate 10a, 10b is pressed with the pressing force of distribution corresponding to the deviation of estimated shape for a target shape of the hot plates 10a, 10b.
申请公布号 JPH09308999(A) 申请公布日期 1997.12.02
申请号 JP19960127047 申请日期 1996.05.22
申请人 HITACHI LTD 发明人 KYOI MASAYUKI;IWAMURA RYOJI;OKAICHI MASAKI
分类号 B30B15/00;B30B1/34;B30B15/22;B30B15/34;H05K3/46;(IPC1-7):B30B15/22 主分类号 B30B15/00
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