| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly efficient and high density multilayer wiring structure, having excellent heat-resisting property, a low dielectric constant and a low thermal expansion coefficient etc., on which a highly precise microscopic via hole can be formed by the process same as a photoresist. SOLUTION: A coating solution, containing dissolved epoxy acrylate resin having fluorene flamework, is applied on an insulating substrate 2, a semihardened film 40 is formed, and its surface is roughened to the prescribed roughness. After a metal compound solution has been applied to the roughened surface and it is heat-treated, either of the above-mentioned dissolved coating solutions is applied again. After baking, an exposure and developing operation is conducted, and a wiring pattern 45 is obtained. A conductor 43 is formed by reducing an exposed metal compound layer of wiring pattern form, and by conducting a substituted paradium plating and electroless plating operation. Subsequently, a resin layer is formed thereon, its surface is roughened, a metal compound layer is formed, a resin layer via pattern 46 is formed thereon, and a conductor 53 is formed. A multilayer wiring structure, having arbitrary number of layers, can be obtained by repeating a layer insulating film forming process and a conductor wiring forming process. |
