SEPARATION METHOD OF SEMICONDUCTOR ELEMENT AND APPARATUS THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device separating method which can easily separate a semiconductor device at a given position at a given timing without use of a needle projecting mechanism, and also to provide an apparatus therefor. SOLUTION: In the semiconductor device separating method, a plurality of semiconductor elements 5 are bonded onto a dicing sheet 25 which can reduce its bond strength when subjected to irradiation of ultraviolet ray, and desired ones of the plurality of semiconductor elements 5 are separated from the dicing sheet 25. The ultraviolet ray is irradiated on a bonded part of the dicing sheet 25 corresponding to a semiconductor element 5a to be separated from a side of the sheet opposed to the semiconductor-element bonded surface so that only the semiconductor element 5a can be sucked and held and then separated from the dicing sheet 25.