发明名称 DEVICE FOR MANUFACTURING DOUBLE COVERED WIRE
摘要 PROBLEM TO BE SOLVED: To provide a device for manufacturing a double covered wire, by which a conductor is easily double covered. SOLUTION: In a device for manufacturing a covered wire, in which a conductor is covered with a resin flowing along a hollow cylindrical connector main body 9, one end face 12a of a resin guide 12 formed into a hollow cylindrical shape smaller in diameter than the base main body is joined to one end face 11a of the base main body to provide a step 13, and the device has a connector 9 in which a groove 14 through which the resin flows is provided around one end face of the base main body. The other end face 12c of the resin guide 12 is tilted in the direction along which the resin flows. The interfacial angleθbetween the other end face of the resin guide and a vertical planeπis set at 1 deg. to 4 deg..
申请公布号 JPH09306266(A) 申请公布日期 1997.11.28
申请号 JP19960121392 申请日期 1996.05.16
申请人 YAZAKI CORP 发明人 MIMURO SHUJI;ICHIKAWA HIROAKI
分类号 B29C47/02;H01B13/14;(IPC1-7):H01B13/14 主分类号 B29C47/02
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