发明名称 PRINTED CIRCUIT BOARD AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To prevent the generation of any solder bridging without augmenting a board even when soldering a part with a fine electrode pitch to the board. SOLUTION: A plurality of patterns comprising conductive members disposed lengthways on a board 1, wherein the patterns having in their end part electrode parts 5 for electric connections and provided adjacently to each other at a specific space are so covered excluding the electrode parts 5 with an electrically insulating covering member 6 that the width of the specific space on the boundary side between the covered part and the electrode parts 5 is larger than the one on the end side of the electrode parts 5, and further, in this specific space of the electrode parts 5, a silk 9 for silk printing is provided as an electrically insulating separation member.
申请公布号 JPH09307220(A) 申请公布日期 1997.11.28
申请号 JP19960125139 申请日期 1996.05.20
申请人 BROTHER IND LTD 发明人 OGURA AKIO
分类号 H05K3/28;H05K1/11;H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/28
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