发明名称 PHOTOSENSITIVE RESIN COMPOUND AND PATTERN FORMATION METHOD WHICH USES IT
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin compound which can form a tough relief pattern which does not leave development and high precision by development easily. SOLUTION: This compound contains repetitive unit shown by the following formula, and contains 100 weight parts of resin compound of which polystyrene conversion molecular weight is 1,000 to 1,000,000 and 1 to 100 weight parts of optical acid generating agent which generates acid due to irradiation of electromagnetic waves. In the formula, A<1> is selected from among quadrivalent aromatic group having the number of carbons of 4 or more, aliphatic hydrocarbon, and cyclic hydrocarbon, and R<1> and R<2> are selected from saturated aliphatic carboxylic acid group having the number of carbons of 20 or less, and they may be the same each other.
申请公布号 JPH09304930(A) 申请公布日期 1997.11.28
申请号 JP19960120199 申请日期 1996.05.15
申请人 HITACHI LTD;HITACHI CHEM CO LTD 发明人 MIWA TAKAO;OKABE YOSHIAKI;MAEKAWA YASUNARI;RAMESU RANKURAADE JIYURARUDEIN;UENO TAKUMI
分类号 G03F7/004;G03F7/037;G03F7/039;H01L21/027;H01L21/312;(IPC1-7):G03F7/039 主分类号 G03F7/004
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