发明名称 SEMICONDUCTOR MODULE AND POWER CIRCUIT USING IT
摘要 PROBLEM TO BE SOLVED: To remove lead wires for wiring for assembling a voltage detection circuit, an electrostatic discharging circuit, etc., with an auxiliary circuit in a power circuit using a semiconductor module. SOLUTION: In an inverter 1 parallelly connecting semiconductor modules 2a, 2b and 3 and a smoothing capacitors 4a to 4c at DC power source terminal panels 5a and 5b, the semiconductor modules 2a and 2b mount electrostatic discharging circuits 61 discharging the charging load of the smoothing capacitors 4a to 4c through resistors respectively connected between their power feeding electrodes 206 and 207, and the semiconductor module 3 amounts a voltage detection circuit 62 detecting whether the voltage level of power feeding voltage applied between power feeding electrodes 306 and 307 is proper. As these electrostatic discharging circuit 61 and the voltage detection circuit 62 are formed on a substrate assembled with the outer surrounding device of each semiconductor module in one body, leading wires for connecting these circuits to a power source are unnecessitated.
申请公布号 JPH09307366(A) 申请公布日期 1997.11.28
申请号 JP19960121762 申请日期 1996.05.16
申请人 DENSO CORP 发明人 ISHIYAMA HIROSHI
分类号 H01L25/07;B60L3/00;H01L25/00;H01L25/18;H02M7/48;H03F3/21 主分类号 H01L25/07
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