WAFER DIVIDING SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a wafer dividing system which recognizes the addresses of streets of a wafer to be cut into two or more blocks so that the block can be specified according to the addresses thereafter and mapping data can be effectively utilized. SOLUTION: The system for dividing a wafer 1 having semiconductor chips 2 sectioned by streets into two or more blocks recognizes the addresses of streets to be cut, makes block data for specifying the blocks according to the addresses, and registers the data in a CPU. The block data contains mapping data utilizable for picking up only required semiconductor chip 2 in a chip pick up step after dicing the block into the semiconductor chips.