LEAD FRAME AND SEMICONDUCTOR DEVICE USING IT

摘要

PROBLEM TO BE SOLVED: To secure close adherence between a lead and a sealing resin trying to improve adherence of solder on an outer lead frame as well as to keep a good adhesive strength and so on between a chip mount of a lead frame and a wire bonding of an inner lead. SOLUTION: To form the most surface of a lead frame made of copper or copper alloy material 30 by plating 29 made of gold or silver on a chip mount and a wire bonding area of an inner lead, plating 28 made of palladium or palladium alloy in the back of the chip mount sealed by a sealing resin 26 and the back of the inner lead, and gold plating film 29 in at least the soldered area of an outer lead 15.