| 摘要 |
PROBLEM TO BE SOLVED: To accurately dice a semiconductor wafer having an Au plated layer on the back surface of a thin GaAs substrate and efficiently die-bonding semiconductor chips resulting from the dicing. SOLUTION: The manufacturing process comprises the steps of adhering a conductive adhesive sheet 13 to an ultraviolet-setting sheet 14 to form a double layer sheet structure, adhering a semiconductor wafer 10 having an Au plated layer on the back surface of a thin GaAs substrate 11 to the adhesive sheet 13 surface, cutting the surface of the substrate 11 until the cuts reach the interior of the sheet 14, irradiating with ultraviolet rays on the back surface of the double layer sheet to weaken the adhesive strength of the ultraviolet-setting sheet 14, thereby separating the semiconductor chip from the adhesive sheet 13 and die-bonding the chip adhered to this sheet at the back surface.
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